SW

PGND

Thermal Pad

PGND

PGND

VIN

VIN

SW

SW

SW

SW

VOUT

VIN

PGND

VIN

PGND

TPS53317

SLUSAK4D – JUNE 2011 – REVISED JULY 2015

www.ti.com

9 Power Supply Recommendations

This device operates from an input voltage supply between 1 V and 6 V. This device requires a separate 5-V

power supply for analog circuits and gate drive. Use the proper bypass capacitors for both the input supply and

the 5-V supply in order to filter noise and to ensure proper device operation.

10 Layout

10.1 Layout Guidelines

Stable power supply operation depends on proper layout. Follow these guidelines for an optimized PCB layout.

•

Connect PGND pins to the thermal pad underneath the device. Use four vias to connect the thermal pad to

internal ground planes.

•

Place VIN, V5IN and VREF decoupling capacitors as close to the device as possible.

•

Use wide traces for the VIN, PGND and SW pins. These nodes carry high current and also serve as heat

sinks.

•

Place feedback and compensation components as close to the device as possible.

•

Place COMP and VOUT analog signal traces away from noisy signals (SW, BST).

•

The GND pin should connect to the PGND in only one place, through a via or a 0-

Ω resistor.

10.2 Layout Example

Figure 41. TPS53317 Board Layout

26

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