GC5016 datasheet(4/88 Pages) TI

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GC5016

SLWS142G − JANUARY 2003 − REVISED NOVEMBER 2005

www.ti.com

7 AC CHARACTERISTICS

−40

°C to 85°C case, supplies across recommended range unless otherwise noted

PARAMETER

MIN

MAX

UNITS

fCK

Clock frequency (1)

(3)

160

MHz

tCKL

Clock low period (below VIL) (1)

tCKH

Clock high period (above VIH) (1)

tr, tf

Clock rise and fall times (VIL to VIH) (4)

tsu

Input set up before CK goes high (AI, BI, CI, DI, SIA, or SIB) (1)

Input hold time after CK goes high (1)

0.5

Data output delay from rising edge of CK. (AO, BO, CO, DO, IFLG, [A−D]FS, [A−D]CK, or SO) (1)

th(o)

Data output hold from rising edge of CK (1)

fJCK

JTAG clock frequency (1)

MHz

tJCKL

JTAG clock low period (below VIL) (1)

tJCKH

JTAG clock high period (above VIH) (1)

tsu(J)

JTAG input (TDI or TMS) set up before TCK goes high (1)

th(J)

JTAG input (TDI or TMS) hold time after TCK goes high (1)

td(J)

JTAG output (TDO) delay from falling edge of TCK (1)

tsu(C)

Control setup during reads or writes. (1)(5)

tsu(EWC)

Control data setup during writes (normal mode). (1)(5)

th(C)

Control hold during writes. (1)(5)

tCSPW

Control strobe (CE and WR low) pulse width (write operation). (1)(5)

td(C)

Control output delay CE and RD low and A stable to C (read operation). (1)(5)

tREC

Control recovery time between reads or writes. (1)(5)

t(CZ)

End of read to HI-Z (2)(5)

IC(DYN)

Core dynamic supply current nominal voltages, 100 MHz, four channels active, full length filters,

high temperature. (6)

420

(1) Each part is tested with a 100°C case temperature for the given specification. Lots are sample tested at −40°C.

(2) Controlled by design and process and not directly tested.

(3) The minimum clock rate is calculated in the cmd5016 configuration program. It may be estimated by (1 + ncic − nfir) x 200 kHz.

(4) Recommended practice

(5) See Figure 27 through Figure 32.

(6) Each port is tested with a 100°C case temperature for the given specification.

General: Timing is measured from CK at VPAD/2 to input or output at VPAD/2. Output loading is a 50-

Ω transmission line whose delay is calibrated

out.

8 THERMAL CHARACTERISTICS

THERMAL CONDUCTIVITY

252 BGA

UNITS

THERMAL CONDUCTIVITY

1 W

UNITS

Theta junction to ambient,

θJA

°C/W

Theta junction to case,

θJC

°C/W

NOTE: Air flow reduces θJA and is highly recommended.

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