CS2 datasheet(51/56 Pages) FUJITSU

51 / 56 page

MB39A214A

Limitation : development tool vendor use only

FUJITSU SEMICONDUCTOR CONFIDENTIAL

DS405-00007-1v0-E

PACKAGE DIMENSIONS

24-pin plastic TSSOP

Lead pitch

0.50 mm

Package width ×

package length

4.40 mm × 6.50 mm

Lead shape

Gullwing

Sealing method

Pl asti c mold

Mounting height

1.20 mm MAX

Weight

0.08 g

24-pin plastic TSSOP

(FPT-24P-M09)

2007-2010 FUJITSU SEMICONDUCTOR LIMITED F24032S-c-2-5

6.50± 0.10 (.256±. 004)

4.40± 0.10 6.40± 0.20

(.252±. 008)

(.173±. 004)

0.10± 0.05

(Mounting height)

0.10(.004)

0.50(.020)

"A"

(Stand off)

0.145± 0.045

(.0057±. 0018)

0.13(.005)

Details of "A" part

0~8°

(.024±. 006)

0.60± 0.15

INDEX

(.004±. 002)

BTM E-MARK

1.10

+0.10

+.004

–0.15

–.006

.043

0.20

+0.07

+.003

–0.02

–.001

.008

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) Pins width and pins thickness include plating thickness.

Note 2) Pins width do not include tie bar cutting remainder.

Note 3) #: These dimensions do not include resin protrusion.

Please check the latest package dimension at the following URL.

http://edevice.fujitsu.com/package/en-search/

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