91C94 datasheet(116/120 Pages) SMSC

116 / 120 page

116

FIGURE 44 - 100 PIN QFP PACKAGE OUTLINE

0.10

-C -

TD/TE

D 1

D IM

D 1

TD(1 )

TE(1)

TD(2 )

TE(2)

MIN

2.80

0. 1

2.57

23. 4

19. 9

17. 4

13. 9

0. 1

0.65

1. 8

MAX

3.15

0.45

2.87

24.15

20. 1

18.15

14. 1

0. 2

0.95

2. 6

MIN

. 11 0

. 00 4

. 10 1

. 92 1

. 78 3

. 68 5

. 54 7

. 00 4

. 02 6

. 07 1

MAX

. 12 4

. 01 8

. 11 3

. 95 1

. 79 1

. 71 5

. 55 5

. 00 8

. 03 7

. 10 2

0°

. 2

21. 8

15. 8

22.21

16.27

12°

. 4

22. 2

16. 2

22.76

16.82

0.65 BSC

0°

. 00 8

. 85 8

. 62 2

. 87 4

. 64 1

12°

. 01 6

. 87 4

. 63 8

. 89 6

. 66 2

.0256 BSC

No te s:

1) Coplana rit y is 0 .100mm (.004 ") maximum.

2) Toler ance on t he pos ition of the lead s is

0.200mm (.008") maximum.

3) Package bod y dimen sions D1 and E1 do not

inc lude the mold pr otrusion. Max imum mold

pro tr usion is 0.2 5mm (.010").

4) D imensions T D a nd TE are impor tant for t est ing

by robot ic h andler. O nly a bo ve combinations of (1)

or (2) ar e ac ceptable.

5) C on tr olling dimension: mil limeter. Dimensions

ini nches for reference only and not necessarily

acc urate .

Mi ll imete rs

Inches

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