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WM8255 Datasheet(PDF) 6 Page - Cirrus Logic |
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WM8255 Datasheet(HTML) 6 Page - Cirrus Logic |
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6 / 49 page ![]() Production Data WM8255 w PD, Rev 4.7, August 2013 6 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at the test conditions specified. ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device. The WM8255 has been classified as MSL1, which has an unlimited floor life at <30 oC / 85% Relative Humidity and therefore will not be supplied in moisture barrier bags. CONDITION MIN MAX Analogue supply voltage: AVDD1 GND - 0.3V GND + 7V Analogue supply voltage: AVDD2 GND - 0.3V GND + 4.2V Digital core supply and I/O voltage: DVDD GND - 0.3V GND + 4.2V Digital ground: DGND GND - 0.3V GND + 0.3V Analogue grounds AGND GND - 0.3V GND + 0.3V Digital inputs, digital outputs and digital I/O pins GND - 0.3V DVDD + 0.3V Analogue input VINP GND - 0.3V AVDD + 0.3V Other pins GND - 0.3V AVDD + 0.3V Operating temperature range: TA 0C +85C Notes: 1. GND denotes the voltage of any ground pin. 2. AGND and DGND pins are intended to be operated at the same potential. Differential voltages between these pins will degrade performance. RECOMMENDED OPERATING CONDITIONS CONDITION SYMBOL MIN TYP MAX UNITS Operating temperature range TA 0 85 C Analogue supply voltage AVDD1 4.75 5.75 6.0 V Analogue supply voltage 1 AVDD2 2.97 3.3 3.63 V Digital Core and I/O supply voltage DVDD 2.97 3.3 3.63 V Notes 1. AVDD2 supply not required if using AVDD1. AVDD2 would require connection to ground via a capacitor in that situation. 2. If AVDD2 is being used, both AVDD2 and DVDD should be operated at the same potential. THERMAL PERFORMANCE PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Performance Thermal resistance – junction to case (5x5x0.9mm package) RθJC Tambient = 25°C 10.27 °C/W Thermal resistance – junction to ambient (5x5x0.9mm package) RθJA 29.45 °C/W Thermal resistance – junction to ambient (4x4x0.85mm package) RθJA 24.05 °C/W Notes: 1. Figures given are for package mounted on 4-layer FR4 according to JESD51-5 and JESD51-7. |
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