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UPD168113 Datasheet(PDF) 48 Page - NEC |
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UPD168113 Datasheet(HTML) 48 Page - NEC |
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48 / 50 page  Data Sheet S16423EJ2V0DS 48 µ PD168113 16. RECOMMENDED SOLDERING CONDITIONS The µ PD168113 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device µ PD168113K9-9B4-A: 56-pin plastic WQFN (8 x 8) Process Conditions Symbol Infrared reflow Package peak temperature: 260 °C, Time: 60 seconds MAX. (at 220°C or higher), Count: Three times or less, Exposure limit: 3 days, Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended IR60-103-3 Caution Do not use different soldering methods together (except for partial heating). |
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