AD9445 datasheet(9/41 Pages) AD

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AD9445

Rev. 0 | Page 8 of 40

ABSOLUTE MAXIMUM RATINGS

Table 5.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

With

Respect

Parameter

Rating

ELECTRICAL

AVDD1

AGND

−0.3 V to +4 V

AVDD2

AGND

−0.3 V to +6 V

DRVDD

DGND

−0.3 V to +4 V

AGND

DGND

−0.3 V to +0.3 V

THERMAL RESISTANCE

AVDD1

DRVDD

−4 V to +4 V

The heat sink of the AD9445 package must be soldered to ground.

AVDD2

DRVDD

−4 V to +6 V

AVDD2

AVDD1

−4 V to +6 V

Table 6.

D0± to D13±

DGND

–0.3 V to DRVDD + 0.3 V

Package Type

θJA

θJB

θJC

Unit

CLK+/CLK−

AGND

–0.3 V to AVDD1 + 0.3 V

100-lead TQFP/EP

19.8

8.3

°C/W

AGND

–0.3 V to AVDD1 + 0.3 V

OUTPUT MODE, DCS

MODE, DFS, SFDR,

RF ENABLE

Typical θJA = 19.8°C/W (heat sink soldered) for multilayer

board in still air.

VIN+, VIN−

AGND

–0.3 V to AVDD2 + 0.3 V

VREF

AGND

–0.3 V to AVDD1 + 0.3 V

Typical θJB = 8.3°C/W (heat sink soldered) for multilayer board

in still air.

SENSE

AGND

–0.3 V to AVDD1 + 0.3 V

REFT, REFB

AGND

–0.3 V to AVDD1 + 0.3 V

Typical θJC = 2°C/W (junction to exposed heat sink) represents

the thermal resistance through heat sink path.

ENVIRONMENTAL

–65°C to +125°C

Storage Temperature

Range

Airflow increases heat dissipation, effectively reducing θJA. Also,

more metal directly in contact with the package leads from

metal traces through holes, ground, and power planes reduces

the θJA. It is required that the exposed heat sink be soldered to

the ground plane.

–40°C to +85°C

Operating Temperature

Range

300°C

Lead Temperature

(Soldering 10 sec)

Junction Temperature

150°C

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.

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