AD9865 datasheet(48/49 Pages) AD

48 / 49 page

Data Sheet

AD9865

Rev. B | Page 47 of 48

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4

0.25 MIN

0.50

0.40

0.30

0.50

BSC

0.20 REF

12° MAX

0.80 MAX

0.65 NOM

1.00

0.85

0.80

7.50 REF

0.05 MAX

0.02 NOM

SEATING

PLANE

PIN 1

INDICATOR

7.25

7.10 SQ

6.95

PIN 1

INDICATOR

0.30

0.23

0.18

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

TOP VIEW

EXPOSED

PAD

BOTTOM VIEW

9.10

9.00 SQ

8.90

8.85

8.75 SQ

8.65

0.60

0.42

0.24

0.60

0.42

0.24

Figure 85. 64-Lead Lead Frame Chip Scale Package (LFCSP)

9 mm × 9 mm and 0.85 mm Package Height

[CP-64-3]

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD9865BCPZ

−40°C to +85°C

64-Lead LFCSP

CP-64-3

AD9865BCPZRL

−40°C to +85°C

64-Lead LFCSP

CP-64-3

Z = RoHS Compliant Part

AD9865 Datasheet(PDF) 48 Page - Analog Devices

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