AD9865 datasheet(10/49 Pages) AD

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Data Sheet

AD9865

Rev. B | Page 9 of 48

ABSOLUTE MAXIMUM RATINGS

Table 8.

Parameter

Rating

ELECTRICAL

AVDD, CLKVDD Voltage

3.9 V maximum

DVDD, DRVDD Voltage

3.9 V maximum

RX+, RX−, REFT, REFB

−0.3 V to AVDD + 0.3 V

IOUTP+, IOUTP−

−1.5 V to AVDD + 0.3 V

IOUTN+, IOUTN−, IOUTG+,

IOUTG−

−0.3 V to +7 V

OSCIN, XTAL

−0.3 V to CLVDD + 0.3 V

REFIO, REFADJ

−0.3 V to AVDD + 0.3 V

Digital Input and Output Voltage

−0.3 V to DRVDD + 0.3 V

Digital Output Current

5 mA maximum

ENVIRONMENTAL

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

125°C

Lead Temperature (Soldering, 10 s)

150°C

Storage Temperature Range

(Ambient)

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

The exposed pad (EPAD) must be soldered to the ground plane

for the 64-lead LFCSP. The EPAD provides an electrical,

thermal, and mechanical connection to the board.

Junction temperature (TJ) can be estimated using the following

equations:

TJ = TT + (ΨJT × P),

TJ = TB + (ΨJB × P)

where:

TT is the temperature measured at the top of the package.

P is the total device power dissipation.

TB is the temperature measured at the board.

ΨJT and ΨJB are thermal characteristic parameters obtained with

θJA in still air test conditions.

Table 9. Thermal Resistance

Package

θJA

θJC

Unit

CP-64-31

23.32

0.7

°C/W

Test condition 1: typical θJA and θJC values are specified for a 4-layer, JESD51-7

high effective thermal conductivity test board for leaded surface-mount

packages. θJA is obtained in still air conditions (JESD51-2). Airflow increases

heat dissipation, effectively reducing θJA. θJC is obtained with the test case

temperature monitored at the bottom of the exposed pad.

ESD CAUTION

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