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RFPIC12C509AF Datasheet(PDF) 96 Page - Microchip Technology |
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RFPIC12C509AF Datasheet(HTML) 96 Page - Microchip Technology |
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96 / 104 page ![]() rfPIC12C509AG/509AF DS70031A-page 94 Preliminary © 2001 Microchip Technology Inc. Package Type: 18-Lead CERDIP 18-Lead Ceramic Dual In-line with Window (JW) - 300 mil (CERDIP) 3.30 3.56 3.81 5.33 5.08 4.83 .210 .200 .190 W2 Window Length .150 .140 .130 W1 Window Width 10.80 9.78 8.76 .425 .385 .345 eB Overall Row Spacing § 0.53 0.47 0.41 .021 .019 .016 B Lower Lead Width 1.52 1.40 1.27 .060 .055 .050 B1 Upper Lead Width 0.30 0.25 0.20 .012 .010 .008 c Lead Thickness 3.81 3.49 3.18 .150 .138 .125 L Tipto SeatingPlane 23.37 22.86 22.35 .920 .900 .880 D Overall Length 7.49 7.37 7.24 .295 .290 .285 E1 Ceramic Pkg. Width 8.26 7.94 7.62 .325 .313 .300 E Shoulder to Shoulder Width 0.76 0.57 0.38 .030 .023 .015 A1 Standoff 4.19 4.06 3.94 .165 .160 .155 A2 Ceramic Package Height 4.95 4.64 4.32 .195 .183 .170 A Top to Seating Plane 2.54 .100 p Pitch 18 18 n Number of Pins MAX NOM MIN MAX NOM MIN Dimension Limits MILLIMETERS INCHES* Units 1 2 D n W2 E1 W1 c eB E p L A2 B B1 A A1 * Controlling Parameter § Significant Characteristic JEDEC Equivalent: MO-036 Drawing No. C04-010 |
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