8 Specifications

8.1 Absolute Maximum Ratings

over junction temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage(2)

VIN, L1, L2, EN, MODE, VOUT, FB, PG

–0.3

6

V

L1, L2 (AC, less than 10 ns)

–3

9

V

–40

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

All voltage values are with respect to network ground pin.

8.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Input voltage

1.3 (1)

5.5

V

Output voltage

1.8

5.2 (2)

V

4

5

μF

L

Effective inductance

0.37

0.47

0.57

μH

TPS63805/TPS63807 Effective capacitance

10

μF

7

8.2

µF

30

μF

21

27

µF

Operating junction temperature

Operating junction

temperature

–40

125

°C

(1)

(2)

8.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)

THERMAL METRIC(1)

TPS6380x

UNIT

3x5 Ball WCSP

15 PINS

Junction-to-ambient thermal resistance

78.8

°C/W

Junction-to-case (top) thermal resistance

0.6

°C/W

Junction-to-board thermal resistance

19.5

°C/W

Junction-to-top characterization parameter

0.3

°C/W

Junction-to-board characterization parameter

19.5

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TPS63805, TPS63806, TPS63807

SLVSDS9E – JULY 2018 – REVISED AUGUST 2021

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