www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

(1.2)

8X (0.5)

(2.3)

10X (0.25)

10X (0.6)

(2)

(R0.05) TYP

(

0.2) VIA

TYP

(0.75)

(0.35)

WSON - 0.8 mm max height

DSK0010A

PLASTIC SMALL OUTLINE - NO LEAD

4218903/B 10/2020

SYMM

1

5

6

10

SYMM

LAND PATTERN EXAMPLE

SCALE:20X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.

11

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)