TPS37 datasheet(6/48 Pages) TI

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted (1)

MIN

MAX

UNIT

Voltage

VDD, VSENSE1,VSENSE2, VRESET1, VRESET2, VRESET1, VRESET2

–0.3

Voltage

VCTS1, VCTS2, VCTR1, VCTR2

–0.3

Current

IRESET1, IRESET2, IRESET1, IRESET2

Temperature (2)

Operating junction temperature, TJ

–40

150

°C

Temperature (2)

Operating Ambient temperature, TA

–40

150

°C

Temperature (2)

Storage, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

As a result of the low dissipated power in this device, it is assumed that TJ = TA.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC

JS-001 (1)

± 2000

Charged device model (CDM), per JEDEC specification

JESD22-C101 (2)

± 750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Voltage

VDD

2.7

Voltage

VSENSE1,VSENSE2, VRESET1, VRESET2, VRESET1, VRESET2

Voltage

VCTS1, VCTS2, VCTR1, VCTR2

5.5

Current

IRESET1, IRESET2, IRESET1, IRESET2

±5

Junction temperature (free air temperature)

–40

125

°C

7.4 Thermal Information

THERMAL METRIC

(1)

TPS37

UNIT

DSK

10-PIN

RθJA

Junction-to-ambient thermal resistance

87.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

76.3

°C/W

RθJB

Junction-to-board thermal resistance

54.2

°C/W

ψJT

Junction-to-top characterization parameter

4.8

°C/W

ψJB

Junction-to-board characterization parameter

54.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

34.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TPS37

SNVSBJ1D – OCTOBER 2020 – REVISED DECEMBER 2021

www.ti.com

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