LT8640 datasheet(2/26 Pages) AD

2 / 26 page

LT8642-1

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VIN, EN/UV, PG, BIAS................................................18V

SW..................................................................VIN + 0.3V

SW (Transient for <25ns)..........................................21V

FB, SS .........................................................................4V

SYNC/MODE Voltage . ................................................6V

Operating Junction Temperature Range (Note 2)

LT8642-1E.......................................... –40°C to 125°C

Storage Temperature Range .................. –65°C to 150°C

Maximum Reflow (Package Body) Temperature ...260°C

(Note 1)

ELECTRICAL CHARACTERISTICS The

denotes the specifications which apply over the full operating

temperature range, otherwise specifications are at TA = 25°C.

ORDER INFORMATION

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Minimum Input Voltage

2.5

2.8

VIN Quiescent Current in Shutdown

VEN/UV = 0V, VIN = 12V

0.75

µA

VIN Quiescent Current in Sleep

VEN/UV = 2V, VFB > 0.597V, VSYNC = 0V, VBIAS = 0V,

VIN = 6V

230

290

340

µA

Feedback Reference Voltage

VIN = 6V, VC = 1.25V

0.594

0.591

0.597

0.600

0.603

Feedback Voltage Line Regulation

VIN = 4.0V to 18V

0.0002

0.02

%/V

Feedback Pin Input Current

VFB = 0.6V

–20

Error Amplifier Transconductance

VC = 1.25V

1.4

1.75

2.05

Error Amp Gain

400

V/V

TOP VIEW

LQFN PACKAGE

20-LEAD (3mm × 4mm × 0.95mm)

JEDEC BOARD: θJA = 41°C/W, θJC(top) = 50.6°C/W, θJC(bottom) = 8.0°C/W (NOTE 3)

DEMO BOARD: θJA = 26°C/W, ΨJT = 0.8°C/W

EXPOSED PAD (PIN 21) IS GND, SHOULD BE SOLDERED TO PCB

BIAS

INTVCC

VIN

GND

CLKOUT

SYNC/MODE

EN/UV

VIN

GND

PART NUMBER

PART MARKING*

FINISH CODE

PAD FINISH

PACKAGE**

TYPE

MSL

RATING

TEMPERATURE RANGE

LT8642EV-1#PBF

86421

Au (RoHS)

LQFN (Laminate Package

with QFN Footprint)

–40°C to 125°C

LT8642EV-1#TRPBF

• Contact the factory for parts specified with wider operating temperature

ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.

Tape and reel specifications.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings

Parts ending with PBF are RoHS and WEEE compliant. **The LT8642-1 package has the same dimensions as a standard 4mm × 3mm QFN package.

LT8640 Datasheet(PDF) 2 Page - Analog Devices

LT8640 Datasheet(HTML) 2 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

Datasheet Download

Link URL