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LT8640 Datasheet(PDF) 3 Page - Analog Devices

Part # LT8640
Description  18V, 10A Synchronous Step-Down Silent Switcher
PDF  26 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LT8640 Datasheet(HTML) 3 Page - Analog Devices

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LT8642-1
3
Rev. 0
For more information www.analog.com
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under
may cause
permanent damage to the device. Exposure to any Absolute Maximum
Rating condition for extended periods may affect device reliability and
lifetime.
Note 2: The LT8642-1E is guaranteed to meet performance specifications
from 0°C to 125°C junction temperature. Specifications over the –40°C
to 125°C operating junction temperature range are assured by design,
characterization, and correlation with statistical process controls.
The junction temperature (TJ, in °C) is calculated from the ambient
temperature (TA in °C) and power dissipation (PD, in Watts) according to
the formula:
TJ = TA + (PD • θJA)
where θJA (in °C/W) is the package thermal impedance.
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VC Source Current
VFB = 0.4V, VC = 1.25V
360
µA
VC Sink Current
VFB = 0.8V, VC = 1.25V
360
µA
VC Pin to Switch Current Gain
8.5
A/V
VC Clamp Voltage
2.6
V
BIAS Pin Current Consumption
VBIAS = 3.3V, fSW = 2MHz
20
mA
Minimum On-Time
ILOAD = 3A, SYNC = 2V
l
20
35
ns
Minimum Off-Time
80
110
ns
Oscillator Frequency
RT = 221k
RT = 60.4k
RT = 18.2k
l
l
l
175
650
1.875
210
700
1.95
245
745
2.00
kHz
kHz
MHz
Top Power NMOS On-Resistance
17.5
mΩ
Top Power NMOS Current Limit
Duty Cycle = 5%
l
14.5
18
21.5
A
Bottom Power NMOS On-Resistance
VINTVCC = 3.4V
8
mΩ
Bottom Power NMOS Current Limit
VINTVCC = 3.4V
10
13
16
A
SW Leakage Current
VIN = 18V, VSW = 0V, 18V
–15
15
µA
EN/UV Pin Threshold
EN/UV Rising
l
0.93
0.99
1.05
V
EN/UV Pin Hysteresis
40
mV
EN/UV Pin Current
VEN/UV = 2V
–20
20
nA
PG Upper Threshold Offset from VFB
VFB Rising
l
5
8
11
%
PG Lower Threshold Offset from VFB
VFB Falling
l
–11
–8
–5
%
PG Hysteresis
0.4
%
PG Leakage
VPG = 3.3V
–40
40
nA
PG Pull-Down Resistance
VPG = 0.1V
l
600
2000
Ω
SYNC/MODE Threshold
SYNC/MODE DC and Clock Low Level Voltage
SYNC/MODE Clock High Level Voltage
SYNC/MODE DC High Level Voltage
l
l
l
0.6
2.2
1.5
2.9
V
V
V
Spread Spectrum Modulation
Frequency Range
RT = 60.4k, VSYNC = 3.3V
22
%
Spread Spectrum Modulation Frequency
VSYNC = 3.3V
3
kHz
SS Source Current
l
1.2
1.9
2.6
µA
SS Pull-Down Resistance
Fault Condition, SS = 0.1V
200
Ω
Note 3: θ values determined per JEDEC 51-7, 51-12. See the Applications
Information section for information on improving the thermal resistance
and for actual temperature measurements of a demo board in typical
operating conditions.
Note 4: This IC includes overtemperature protection that is intended to
protect the device during overload conditions. Junction temperature will
exceed 150°C when overtemperature protection is active. Continuous
operation above the specified maximum operating junction temperature
will reduce lifetime.



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