LTC4271 datasheet(28/30 Pages) AD

28 / 30 page

LTC9101-3/LTC9103

Rev. 0

For more information www.analog.com

PACKAGE DESCRIPTION

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 ±0.05

0.50 BSC

9.50 REF

5.50 REF

6.10 ±0.05

7.50 ±0.05

4.40 ±0.05

8.80 ±0.05

4.80 ±0.05

10.10 ±0.05

11.50 ±0.05

0.25 ±0.05

PACKAGE

OUTLINE

7.00 ±0.10

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

PIN 1

TOP MARK

(SEE NOTE 6)

BOTTOM VIEW—EXPOSED PAD

9.50 REF

11.00 ±0.10

0.75 ±0.05

R = 0.125

TYP

R = 0.10

TYP

0.25 ±0.05

(UKJ64) QFN 0119 REV Ø

0.50 BSC

0.200 REF

0.00 – 0.05

5.50 REF

0.40 ±0.10

8.80 ±0.10

4.40

±0.10

4.80 ±0.10

0.55 REF

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1 NOTCH

R = 0.30 TYP OR

0.35 × 45° CHAMFER

UKJ Package

64-Lead Plastic QFN (7mm × 11mm)

(Reference LTC DWG # 05-08-1780 Rev Ø)

LTC4271 Datasheet(PDF) 28 Page - Analog Devices

LTC4271 Datasheet(HTML) 28 Page - Analog Devices

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