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MPC8610EC Datasheet(PDF) 87 Page - NXP Semiconductors

Part # MPC8610EC
Description  MPC8610 Integrated Host Processor Hardware Specifications
PDF  96 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPC8610EC Datasheet(HTML) 87 Page - NXP Semiconductors

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Hardware Design Considerations
MPC8610 Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
87
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see Figure 54).
Therefore, synthetic grease offers the best thermal performance, considering the low interface pressure, and is recommended.
Of course, the selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, and so on.
Figure 56. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be selected
based on high conductivity and mechanical strength to meet equipment shock/vibration requirements. There are several
commercially available thermal interfaces and adhesive materials provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78
th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Corporate Center
PO Box 994
Midland, MI 48686-0994
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
0
0.5
1
1.5
2
0
1020
30
40
50607080
Silicone Sheet (0.006 in.)
Bare Joint
Fluoroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)



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