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SE050 Datasheet(PDF) 20 Page - NXP Semiconductors |
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SE050 Datasheet(HTML) 20 Page - NXP Semiconductors |
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20 / 32 page ![]() NXP Semiconductors SE050 Plug & Trust Secure Element 14.2 AC characteristics Conditions: VCC = 1.62 V to 3.6 V; VSS = 0 V; Tamb = -40 °C to +105 °C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit tEEP FLASH erase + program time [2] 2.3 ms tEEE FLASH erase time 0.9 ms tEEW FLASH program time 1.4 ms tEER FLASH data retention time Tamb = +55 °C 25 years NEEC FLASH endurance (maximum number of programming cycles applied to the whole memory block performed by NXP static and dynamic wear leveling algorithm) 20 × 106 100 × 106 cycles Table 13. Non-volatile memory timing characteristics [1] Typical values are only referenced for information. They are subject to change without notice. [2] Given value specifies physical access times of FLASH memory only. SCL, SDA pads in open-drain mode. Symbol Parameter Conditions Min Typ Max Unit Input/Output: I2C_SDA, I2C_SCL in open-drain mode trIO I/O Input rise time Input/reception mode [2] 1 μs tfIO I/O Input fall time Input/reception mode [2] 1 μs tfOIO I/O Output fall time Output/transmission mode; CL = 30 pF [2] 0.3 μs fCLK External clock frequency in I2C applications tCLKW, Tamb and VCC in their specified limits - 3.4 MHz tPD Power down duration time (I2C wake-up) CPU clock = 48 MHz [3] 67 μs tWKPD Wake-up from power down duration time (I2C wake-up) CPU clock = 48 MHz [4] 97 μs CPIN Pin capacitances RST_N, I2C_SDA, /I2C_SCL Test frequency = 1 MHz; Tamb = 25 °C - 10.5 pF tENalt ENA low time and Vout, Vcc low time for entering deep power down mode [5] 2 μs Ron Resistance of power switch Tamb=105 °C, Iload=25 mA, Vin=1.62 V 1.1 Ohm Iout maximum current driving capability of pin Vout Tamb=105 °C 25 mA Inputs: RST_N (active only if ISO7816 UART interface is enabled) Table 14. Electrical AC characteristics of I2C_SDA, I2C_SCL, and RST_N[1]; VCC = 1.8 V ± 10 % or 3 V ± 10 % V; VSS = 0 V; Tamb = -40 °C to + 105 °C SE050 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved. Product data sheet Rev. 3.5 — 22 August 2022 504935 20 / 32 |
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