SE050 datasheet(32/32 Pages) NXP

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NXP Semiconductors

SE050

Plug & Trust Secure Element

Contents

Introduction ......................................................... 1

1.1

SE050 use cases .............................................. 1

1.2

SE050 target applications ..................................2

1.3

SE050 naming convention .................................2

Features and benefits .........................................3

2.1

Key benefits .......................................................3

2.2

Key features ...................................................... 3

2.3

Features in detail ...............................................4

Functional description ........................................6

3.1

Functional diagram ............................................ 6

3.1.1

Random number generator ............................... 6

3.1.2

Supported secure object types .......................... 6

3.1.3

Access control ................................................... 7

3.1.4

Sessions and multi-threading ............................ 7

3.1.5

Attestation and trust provisioning .......................7

3.1.6

Application support ............................................ 7

3.2

Credential Storage & Memory ........................... 8

3.3

Preprovisioned "Ease of Use"

configurations .....................................................8

3.4

Startup behaviour .............................................. 8

Communication interfaces ................................. 8

4.1

I2C Interfaces .................................................... 8

4.1.1

Supported I2C frequencies ................................9

4.2

ISO7816 and ISO14443 Interface ..................... 9

Power-saving modes .......................................... 9

5.1

Power-down mode .............................................9

5.2

Deep Power-down mode ................................. 10

Ordering information ........................................ 10

6.1

Ordering options .............................................. 10

6.2

Ordering SE050 samples ................................ 11

6.3

Configuration ....................................................11

Pinning information .......................................... 12

7.1

Pinning .............................................................12

7.1.1

Pinning HX2QFN20 ......................................... 12

Package ..............................................................13

Marking ...............................................................13

Packing information ..........................................13

10.1

Reel packing ....................................................13

Electrical and timing characteristics ...............14

Limiting values ..................................................14

Recommended operating conditions .............. 14

Characteristics .................................................. 15

14.1

DC characteristics ............................................15

14.1.1

General and General Purpose I/O interface .....15

14.1.2

I2C Interface .................................................... 19

14.1.3

Power consumption ......................................... 19

14.2

AC characteristics ............................................20

14.3

I2C Bus Timings .............................................. 23

14.4

EMC/EMI ..........................................................24

Abbreviations .................................................... 25

References .........................................................27

Revision history ................................................ 28

Legal information ..............................................29

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

Date of release: 22 August 2022

Document number: 504935

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