1996 Mar 22

38

Philips Semiconductors

Product specification

Microcontrollers for TV and video (MTV)

83C145; 83C845

83C055; 87C055

22 SOLDERING

22.1

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

cases reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook” (order code 9398 652 90011).

22.2

Soldering by dip or wave

The maximum permissible temperature of the solder is

260

°C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted to the seating plane, but the

temperature of the plastic body must not exceed the

specified storage maximum. If the printed-circuit board has

been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within

the permissible limit.

22.3

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300

°C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400

°C, contact may be up to 5 seconds.

23 DEFINITIONS

24 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the specification

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.