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ADS1113 Datasheet(PDF) 6 Page - Texas Instruments |
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ADS1113 Datasheet(HTML) 6 Page - Texas Instruments |
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6 / 50 page ![]() 6.4 Thermal Information THERMAL METRIC(1) DGS (VSSOP) NKS (UQFN) UNIT 10 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 170.9 126.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 61.0 52.0 °C/W RθJB Junction-to-board thermal resistance 91.2 60.6 °C/W ψJT Junction-to-top characterization parameter 8.5 1.1 °C/W ψJB Junction-to-board characterization parameter 89.8 60.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note. ADS1113-Q1, ADS1114-Q1, ADS1115-Q1 SBAS563E – DECEMBER 2011 – REVISED DECEMBER 2022 www.ti.com 6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: ADS1113-Q1 ADS1114-Q1 ADS1115-Q1 |
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