ADM1067ASU datasheet(9/32 Pages) AD

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ADM1067

Rev. B | Page 9 of 32

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Voltage on VH Pin

16 V

Voltage on VPn Pins

7 V

Voltage on VXn Pins

−0.3 V to +6.5 V

Voltage on A0, A1 Pins

−0.3 V to +7 V

Voltage on REFOUT Pin

5 V

Voltage on VDDCAP, VCCP Pins

6.5 V

Voltage on DACn Pins

6.5 V

Voltage on PDOn Pins

16 V

Voltage on SDA, SCL Pins

7 V

Voltage on GND, AGND, PDOGND, REFGND Pins

−0.3 V to +0.3 V

Voltage on MUP and MDN Pins

VDDCAP + 0.6 V

Input Current at Any Pin

±5 mA

Package Input Current

±20 mA

Maximum Junction Temperature (TJ max)

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature

Soldering Vapor Phase, 60 sec

215°C

ESD Rating, All Pins

2000 V

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

Unit

40-Lead LFCSP

°C/W

48-Lead TQFP

°C/W

ESD CAUTION

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