RT1716

7

DS1716-04

March 2020

www.richtek.com

©

Copyright

2020 Richtek Technology Corporation. All rights reserved.

is a registered trademark of Richtek Technology Corporation.

Note 1. Stresses beyond those listed under

“Absolute Maximum Ratings” may cause permanent damage to the device.

These are stress ratings only, and functional operation of the device at these or any other conditions beyond those

indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating

conditions may affect device reliability.

Note 2.

θJA is measured under natural convection (still air) at TA = 25°C with the component mounted on a high effective-

thermal-conductivity four-layer test board on a JEDEC 51-7 thermal measurement standard.

Note 3. Devices are ESD sensitive. Handling precaution is recommended.

Note 4. The device is not guaranteed to function outside its operating conditions.

Note 5. When VCONN doesn't use, VCONN short to GND.

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

UFP Pull-Down Voltage in

Dead Battery Under

DFP330

μA

VDBH

VDD = 0V

--

--

2.6

V

I

2C Electrical Characteristics

I2C Bus Supply Voltage

I2C_VDD

VDD = 3V to 5.5V

1.5

--

3.6

V

LOW-Level Input Voltage

VIL

VDD = 3V to 5.5V

--

--

0.4

V

HIGH-Level Input Voltage

VIH

VDD = 3V to 5.5V

1.3

--

--

V

LOW-Level Output Voltage

VOL

VDD = 3V to 5.5V, Open-drain

--

--

0.4

V

Input Current Each IO Pin

II

VDD = 3V to 5.5V,

0.1VDD < VI < 0.9VDDMAX

−10

--

10

μA

SCL Clock Frequency

fSCL

VDD = 3V to 5.5V

0

--

3400

kHz

Pulse width of spikes that

must be suppressed by the

input filter

tSP

VDD = 3V to 5.5V

--

--

50

ns

Data Hold Time

tHD:DAT

VDD = 3V to 5.5V

30

--

--

ns

Data Set-Up Time

tSU:DAT

VDD = 3V to 5.5V

70

--

--

ns