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ES9826 Datasheet(PDF) 87 Page - ESS Technology,Inc

Part # ES9826
Description  32-bit High performance 2 Channel ADC w/PGA
PDF  88 Pages
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Manufacturer  ESS [ESS Technology,Inc]
Direct Link  http://www.esstech.com
Logo ESS - ESS Technology,Inc

ES9826 Datasheet(HTML) 87 Page - ESS Technology,Inc

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ES9826 Datasheet
VERSION 0.1.2
87
ESS TECHNOLOGY, INC. 109 Bonaventura Drive, San Jose, CA 95134, USA Tel (408) 643-8800 • WWW.ESSTECH.COM
RPC-2 Pb-Free Process – Classification Temperatures (Tc)
Package Thickness
Volume mm3, <350
Volume mm3, 350 to 2000
Volume mm3, >2000
<1.6 mm
260°C
260°C
260°C
1.6 mm – 2.5 mm
260°C
250°C
245°C
>2.5 mm
250°C
245°C
245°C
Table 27 – RPC-2 Pb free classification temperatures
At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body
temperature (Tp) can exceed the values specified in Table RPC-2. The use of a higher Tp does not change the
classification temperature (Tc).
Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.
The maximum component temperature reached during reflow depends on package thickness and volume. The use of
convection reflow processes reduces the thermal gradients between packages. However, thermal gradients due to
differences in thermal mass of SMD packages may still exist.



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