RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS20151001

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

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RF5216

PCB Design Guidelines

PCB Surface Finish

The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 2 to 5

µinch gold over 180 µinch nickel.

PCB Land Pattern

PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown

has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate

lead and package tolerances. Since surface mount processes vary from company to company, careful process development is

recommended.

PCB Metal Land and Solder Mask Pattern