8 Device and Documentation Support

8.1 Device Support

8.1.1 Development Support

• LPV521 PSPICE Model

• TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti

• Capacitive Load Drive Solution Using an Isolation Resistor reference design

• DIP Adapter Evaluation Module, http://www.ti.com/tool/dip-adapter-evm

• Evaluation board for 5-pin, north-facing amplifiers in the SC70 package, SNOA487.

• Manual for LMH730268 Evaluation board 551012922-001

8.2 Documentation Support

8.2.1 Related Documentation

For related documentation, see the following:

• Texas Instruments, Feedback Plots Define Op Amp AC Performance application bulletin

• Texas Instruments, AN-1698 A Specification for EMI Hardened Operational Amplifiersapplication report

• Texas Instruments, EMI Rejection Ratio of Operational Amplifiers application report

• Texas Instruments, Handbook of Operational Amplifier Applications application report

8.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

8.4 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

8.5 Trademarks

TI E2E™ is a trademark of Texas Instruments.

PowerWise® is a registered trademark of Texas Instruments.

Bluetooth® is a registered trademark of Bluetooth SIG, Inc..

Wi-Fi® is a registered trademark of The Wi-Fi Alliance.

All trademarks are the property of their respective owners.

8.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

8.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

LPV521

SNOSB14E – AUGUST 2009 – REVISED JULY 2024

www.ti.com

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