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AM3359 Datasheet(PDF) 153 Page - Texas Instruments |
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AM3359 Datasheet(HTML) 153 Page - Texas Instruments |
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153 / 256 page ![]() A1 A1 LPDDR Device 153 AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351 www.ti.com SPRS717L – OCTOBER 2011 – REVISED MARCH 2020 Submit Documentation Feedback Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351 Peripheral Information and Timings Copyright © 2011–2020, Texas Instruments Incorporated 7.7.2.1.2.5 LPDDR Keepout Region The region of the PCB used for the LPDDR circuitry must be isolated from other signals. The LPDDR keepout region is defined for this purpose and is shown in Figure 7-35. This region should encompass all LPDDR circuitry and the region size varies with component placement and LPDDR routing. Additional clearances required for the keepout region are shown in Table 7-37. Non-LPDDR signals must not be routed on the same signal layer as LPDDR signals within the LPDDR keepout region. Non-LPDDR signals may be routed in the region provided they are routed on layers separated from LPDDR signal layers by a ground layer. No breaks should be allowed in the reference ground or VDDS_DDR power plane in this region. In addition, the VDDS_DDR power plane should cover the entire keepout region. Figure 7-35. LPDDR Keepout Region 7.7.2.1.2.6 Bulk Bypass Capacitors Bulk bypass capacitors are required for moderate speed bypassing of the LPDDR and other circuitry. Table 7-38 contains the minimum numbers and capacitance required for the bulk bypass capacitors. Note that this table only covers the bypass needs of the AM335x LPDDR interface and LPDDR devices. Additional bulk bypass capacitance may be needed for other circuitry. Table 7-38. Bulk Bypass Capacitors(1) NO. PARAMETER MIN MAX UNIT 1 AM335x VDDS_DDR bulk bypass capacitor count 1 Devices 2 AM335x VDDS_DDR bulk bypass total capacitance 10 μF 3 LPDDR#1 bulk bypass capacitor count 1 Devices 4 LPDDR#1 bulk bypass total capacitance 10 μF 5 LPDDR#2 bulk bypass capacitor count(2) 1 Devices 6 LPDDR#2 bulk bypass total capacitance(2) 10 μF (1) These devices should be placed near the device they are bypassing, but preference should be given to the placement of the high-speed (HS) bypass capacitors. (2) Only used when two LPDDR devices are used. |
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