Data Sheet

LTM4640

analog.com

Rev. 0

5 of 38

(TA = 25°C. VIN = 12V per the typical application shown in Figure 1, unless otherwise specified.)

PARAMETER

SYMBOL

CONDITIONS

COMMENTS

MIN

TYP

MAX UNITS

Output current

limit

IOUTPK

VIN = 12V, VOUT = 1.5V

26

A

Voltage at FB pin

VFB

IOUT = 0A, VOUT = 1.5V

–40°C ≤ TJ ≤

125°C

0.594 0.60 0.606

V

Current at FB pin

IFB

3

±30

nA

Resistor between

VOSNS+ and FB pins

RFBHI

10

kΩ

Track pin soft start

pull-up current

ITRACK/SS

TRACK/SS = 0V

6

10

µA

VIN Undervoltage

lockout

VIN(UVLO)

VIN falling

2.45

2.6

2.75

V

VIN hysteresis

350

mV

Minimum on-time

tON(MIN)

3

25

ns

Minimum off-time

tOFF(MIN)

3

50

ns

PGOOD trip level

VPGOOD

VFB with respect to set output

VFB ramping negative

–12

–8

–5

%

VFB with respect to set output

VFB ramping positive

5

8

12

%

PGOOD leakage

IPGOOD

VPGOOD = INTVCC, VFB = 0.6V

2

µA

PGOOD voltage

low

VPGL

IPGOOD = 1mA

0.02

0.1

V

Internal VCC

voltage

VINTVCC

VIN = 4V to 20V

3.2

3.3

3.4

V

Oscillator

frequency

fOSC

600

kHz

1

The LTM4640, including the E-grade and I-grade parts (see Table 14), is tested under pulsed load conditions

such as that TJ ≈ TA. The LTM4640E is guaranteed to meet performance specifications over the 0°C to 125°C

internal operating temperature range. Specifications over the –40°C to 125°C internal operating temperature

range are assured by design, characterization, and correlation with statistical process controls. The

LTM4640I is guaranteed to meet specifications over the full –40°C to 125°C internal operating temperature

range. Note that the maximum ambient temperature consistent with these specifications is determined by

specific operating conditions in conjunction with board layout, the rated package thermal resistance, and

other environmental factors.

2

See Thermal Considerations and Output Current Derating for different VIN, VOUT, and TA conditions.

3

100% tested at wafer level.

4

The LTM4640, includes overtemperature protection that is intended to protect the device during momentary

overload conditions. The junction temperature exceeds 125°C when overtemperature protection is active.

Continuous operation above the specified maximum operating junction temperature may impair the

device’s reliability.

5

Guaranteed by design. Validated from bench measurements.