SC416 datasheet(27/34 Pages) SEMTECH

27 / 34 page

SC416

analog components without crossing the high-noise

power signals (DH/DL/BST, etc).

The analog components are those which connect to the

FB and VOUT pins. The FB pins are sensitive so the cop-

per area of these traces should be minimized. Compo-

nents connected to FB should be placed directly near the

IC and should not be placed over or near the gate drive

or power signals (DL/DH/BST/ILIM/LX/VDD).

The connection between power ground (PAD) and ana-

log ground (RTN) should be done at a single point direct-

ly at the IC. The analog components should be placed

in their own ground island which connects to the PAD

directly at the IC, and all analog components should con-

nect directly to this island.

Overall placement should look similar to Figure 22.

Figure 22

Applications Information (continued)

GND

(PAD)

SC416

Side 1 Power

Components

Side 2 Power

Components

Side 1

Analog

Components

Side 2

Analog

Components

The VDD supply decoupling capacitors should connect

to the IC with short traces, with multiple vias if needed.

Connect the ILIM traces to the low-side MOSFET directly

at the drain pins, and route these traces over to the ILIM

resistor on another layer if needed.

Route the VOUT/FB feedback traces in a “quiet” layer,

away from noise sources. Avoid routing near any of the

high-noise switching signals or other noise sources.

SC416 Datasheet(PDF) 27 Page - Semtech Corporation