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LM10506 Datasheet(PDF) 35 Page - Texas Instruments

Part # LM10506
Description  LM10506 Triple Buck LDO Power Management Unit
PDF  43 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

LM10506 Datasheet(HTML) 35 Page - Texas Instruments

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LM10506
COUT
CIN
L
P
N
S
S
D
D
G
G
LOOP1
LOOP2
LM10506
www.ti.com
SNVS729F – SEPTEMBER 2011 – REVISED AUGUST 2014
10 Power Supply Recommendations
The device is designed to operate from a fixed input voltage supply at 3.3 V or 5 V but will operate at input
voltages between 3 V to 5.5 V.
11 Layout
11.1 Layout Guidelines
11.1.1 PCB Layout Considerations
PC board layout is an important part of DC-DC converter design. Poor board layout can disrupt the performance
of a DC-DC converter and surrounding circuitry by contributing to EMI, ground bounce, and resistive voltage loss
in the traces. These can send erroneous signals to the DC-DC converter resulting in poor regulation or instability.
Good layout can be implemented by following a few simple design rules.
Schematic Of LM10506 Highlighting Layout Sensitive Nodes
1. Minimize area of switched current loops. In a buck regulator there are two loops where currents are switched
rapidly. The first loop starts from the CIN input capacitor, to the regulator SWx_VIN pin, to the regulator SW
pin, to the inductor then out to the output capacitor COUT and load. The second loop starts from the output
capacitor ground, to the regulator SWx_GND pins, to the inductor and then out to COUT and the load (see
above). To minimize both loop areas the input capacitor should be placed as close as possible to the VIN
pin. Grounding for both the input and output capacitors should consist of a small localized top side plane that
connects to PGND. The inductor should be placed as close as possible to the SW pin and output capacitor.
2. Minimize the copper area of the switch node. The SW pins should be directly connected with a trace that
runs on top side directly to the inductor. To minimize IR losses this trace should be as short as possible and
with a sufficient width. However, a trace that is wider than 100 mils will increase the copper area and cause
too much capacitive loading on the SW pin. The inductors should be placed as close as possible to the SW
pins to further minimize the copper area of the switch node.
3. Have a single point ground for all device analog grounds. The ground connections for the feedback
components should be connected together then routed to the GND pin of the device. This prevents any
switched or load currents from flowing in the analog ground plane. If not properly handled, poor grounding
can result in degraded load regulation or erratic switching behavior.
4. Minimize trace length to the FB pin. The feedback trace should be routed away from the SW pin and inductor
to avoid contaminating the feedback signal with switch noise.
5. Make input and output bus connections as wide as possible. This reduces any voltage drops on the input or
output of the converter and can improve efficiency. If voltage accuracy at the load is important make sure
feedback voltage sense is made at the load. Doing so will correct for voltage drops at the load and provide
the best output accuracy.
Outside 7x7 array 0.4 mm 34-bump DSBGA, with 24 peripheral and 6 inner vias = 30 individual signals
Copyright © 2011–2014, Texas Instruments Incorporated
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35
Product Folder Links: LM10506



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