LM10506

www.ti.com

SNVS729F – SEPTEMBER 2011 – REVISED AUGUST 2014

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VIN, VCOMP

−0.3

6

V

VIN_IO, VIN_B1, VIN_B2, VIN_B3, SPI_CS, SPI_DI, SPI_CLK, SPI_DO, IRQ, HL_B2, HL_B3,

−0.3

6

STANDBY, RESET, SW_B1, SW_B2, SW_B3, FB_B1, FB_B2, FB_B3, LDO

Junction Temperature (TJ-MAX)

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Internal thermal shutdown protects device from permanent damage. Thermal shutdown engages at TJ = 140°C and disengages at TJ =

120°C (typ.). Thermal shutdown is ensured by design.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

7.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–2000

2000

V(ESD)

Electrostatic discharge

V

pins(1)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN_B1, VIN_B2_VIN_B3, VIN

3

5.5

VIN_IO (< VIN)

1.72

3.63 (but < VIN)

V

All pins except VIN_IO

0

VIN

Junction temperature (TJ)

−40

125

°C

Ambient temperature (TA)

−40

85

Maximum continuous power dissipation (PD-MAX)

(1)

0.9

W

(1)

In applications where high power dissipation and/or poor thermal resistance is present the maximum ambient temperature may have to

be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C),

the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

7.4 Thermal Information

LM10506

THERMAL METRIC(1)

DSBGA

UNIT

34 PINS

RθJA

Junction-to-ambient thermal resistance

44.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

Copyright © 2011–2014, Texas Instruments Incorporated

Submit Documentation Feedback

5

Product Folder Links: LM10506