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OPA340, OPA2340, OPA4340

www.ti.com

SBOS073C – SEPTEMBER 1997 – REVISED AUGUST 2016

Product Folder Links: OPA340 OPA2340 OPA4340

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Copyright © 1997–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should

be current limited to 10 mA or less.

(3)

Short-circuit to ground, one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage

Supply voltage

5.5

V

Signal input terminals(2)

–0.5

0.5

Current

Signal input terminals(2)

10

mA

Output short circuit(3)

Continuous

Temperature

Operating, TA

–55

125

°C

Junction, TJ

150

Storage, Tstg

–55

125

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±600

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±250

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

2.7

5.5

V

Specified temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information – OPA340

THERMAL METRIC(1)

OPA340

UNIT

DBV

(SOT-23)

P

(PDIP)

D

(SOIC)

D

(SOIC)

5 PINS

8 PINS

8 PINS

14 PINS

RθJA

Junction-to-ambient thermal resistance

207.9

53.1

142

83.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

71.2

42.5

90.2

70.7

°C/W

RθJB

Junction-to-board thermal resistance

36.0

30.3

82.5

59.5

°C/W

ψJT

Junction-to-top characterization parameter

2.0

19.7

39.4

11.6

°C/W

ψJB

Junction-to-board characterization parameter

35.2

30.2

82

37.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

—

—

—

°C/W