TMUX6213 datasheet(3/45 Pages) TI2

3 / 45 page

4 Device Comparison Table

PRODUCT

DESCRIPTION

TMUX6211

Low-Leakage-Current, Precision, 4-Channel, 1:1 (SPST) Switches (Logic Low)

TMUX6212

Low-Leakage-Current, Precision, 4-Channel, 1:1 (SPST) Switches (Logic High)

TMUX6213

Low-Leakage-Current, Precision, 4-Channel, 1:1 (SPST) Switches (Logic Low + Logic High)

5 Pin Configuration and Functions

Figure 5-1. PW Package 16-Pin TSSOP Top View

Figure 5-2. RUM Package 16-Pin WQFN Top View

Table 5-1. Pin Functions

TYPE(1)

DESCRIPTION(2)

NAME

TSSOP

WQFN

I/O

Drain pin 1. Can be an input or output.

I/O

Drain pin 2. Can be an input or output.

I/O

Drain pin 3. Can be an input or output.

I/O

Drain pin 4. Can be an input or output.

GND

Ground (0 V) reference

N.C.

—

No internal connection. Can be shorted to GND or left floating.

I/O

Source pin 1. Can be an input or output.

I/O

Source pin 2. Can be an input or output.

I/O

Source pin 3. Can be an input or output.

I/O

Source pin 4. Can be an input or output.

I/O

Source pin 3. Can be an input or output.

SEL1

Logic control input 1, has internal 4 MΩ pull-down resistor. Controls channel 1 state as shown in Section 8.5.

SEL2

Logic control input 2, has internal 4 MΩ pull-down resistor. Controls channel 2 state as shown in Section 8.5.

SEL3

Logic control input 3, has internal 4 MΩ pull-down resistor. Controls channel 3 state as shown in Section 8.5.

SEL4

Logic control input 4, has internal 4 MΩ pull-down resistor. Controls channel 4 state as shown in Section 8.5.

VDD

Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a

decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.

VSS

Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this

pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 μF to

10 μF between VSS and GND.

Thermal Pad

—

The thermal pad is not connected internally. No requirement to solder this pad, if connected it is recommended

that the pad be left floating or tied to GND

(1)

I = input, O = output, I/O = input and output, P = power.

(2)

Refer to Section 8.4 for what to do with unused pins.

www.ti.com

TMUX6211, TMUX6212, TMUX6213

SCDS431D – OCTOBER 2020 – REVISED JULY 2024

Submit Document Feedback

Product Folder Links: TMUX6211 TMUX6212 TMUX6213

TMUX6213 Datasheet(PDF) 3 Page - Texas Instruments

TMUX6213 Datasheet(HTML) 3 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45

Datasheet Download

Link URL