TMUX6213 datasheet(30/45 Pages) TI2

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in parallel lowers the overall inductance and is beneficial for connections to ground and power planes. Always

ensure the ground (GND) connection is established before supplies are ramped.

9.4 Layout

9.4.1 Layout Guidelines

When a PCB trace turns a corner at a 90° angle, a reflection can occur. A reflection occurs primarily because of

the change of width of the trace. At the apex of the turn, the trace width increases to 1.414 times the width. This

increase upsets the transmission-line characteristics, especially the distributed capacitance and self–inductance

of the trace which results in the reflection. Not all PCB traces can be straight and therefore some traces must

turn corners. Figure 9-4 shows progressively better techniques of rounding corners. Only the last example

(BEST) maintains constant trace width and minimizes reflections.

WORST

BETTER

BEST

1W min.

Figure 9-4. Trace Example

Route high-speed signals using a minimum of vias and corners which reduces signal reflections and impedance

changes. When a via must be used, increase the clearance size around it to minimize its capacitance.

Each via introduces discontinuities in the signal’s transmission line and increases the chance of picking up

interference from the other layers of the board. Be careful when designing test points, through-hole pins are not

recommended at high frequencies.

Figure 9-5 shows an example of a PCB layout with the TMUX621x.

Some key considerations are:

• For reliable operation, connect a decoupling capacitor ranging from 0.1µF to 10µF between VDD/VSS and

GND. We recommend a 0.1µF and 1µF capacitor, placing the lowest value capacitor as close to the pin as

possible. Make sure that the capacitor voltage rating is sufficient for the supply voltage.

• Keep the input lines as short as possible.

• Use a solid ground plane to help reduce electromagnetic interference (EMI) noise pickup.

• Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if

possible, and only make perpendicular crossings when necessary.

• Using multiple vias in parallel will lower the overall inductance and is beneficial for connection to ground

planes.

TMUX6211, TMUX6212, TMUX6213

SCDS431D – OCTOBER 2020 – REVISED JULY 2024

www.ti.com

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TMUX6213 Datasheet(PDF) 30 Page - Texas Instruments