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TPA2016D2

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SLOS524E – JUNE 2008 – REVISED MAY 2016

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Layout Guidelines (continued)

(1)

Circuit traces from NSMD defined PWB lands should be 75

μm to 100 μm wide in the exposed area inside the solder mask opening.

Wider trace widths reduce device stand off and impact reliability.

(2)

Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the

intended application.

(3)

Recommend solder paste is Type 3 or Type 4.

(4)

For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.

(5)

Solder mask thickness should be less than 20

μm on top of the copper circuit pattern

(6)

Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in

inferior solder paste volume control.

(7)

Trace routing away from DSBGA device should be balanced in X and Y directions to avoid unintentional component movement due to

solder wetting forces.

Table 15. Land Pattern Dimensions(1)(2)(3)(4)

SOLDER PAD

DEFINITIONS

COPPER PAD

SOLDER MASK(5)

OPENING

COPPER

THICKNESS

STENCIL(6)(7) OPENING

STENCIL

THICKNESS

Non solder mask

defined (NSMD)

275

μm

(+0.0, –25

μm)

375

μm

(+0.0, –25

μm)

1 oz max (32

μm)

275

μm × 275 μm Sq. (rounded

corners)

125

μm thick

Figure 45. Land Pattern Dimensions