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TPA2016D2 Datasheet(PDF) 47 Page - Texas Instruments |
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TPA2016D2 Datasheet(HTML) 47 Page - Texas Instruments |
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47 / 51 page ![]() NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PACKAGE OUTLINE www.ti.com 4219125 / A 10/2016 WQFN - 0.8 mm max height PLASTIC QUAD FLATPACK - NO LEAD RTJ0020D 0.1 C A B 0.05 C 4.1 3.9 4.1 3.9 B A PIN 1 INDEX AREA C 0.8 MAX 0.05 0.00 SEATING PLANE 20X 0.29 0.19 20 PIN 1 ID (OPTIONAL) EXPOSED THERMAL PAD SYMM SYMM (A) TYP 0.08 C 16X 0.5 15 1 DIM A OPT 1 OPT 2 (0.1) (0.2) 16 11 5 6 10 21 4X 2 20X 0.5 0.3 |
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