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LM5145 Datasheet(PDF) 27 Page - Texas Instruments

Part # LM5145
Description  LM25139 42V, Synchronous Buck DC/DC Controller With Dual Random Spread Spectrum for Advanced EMI Mitigation
PDF  60 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

LM5145 Datasheet(HTML) 27 Page - Texas Instruments

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• RDS(on) at VGS = 5V
• Drain-source voltage rating, BVDSS, typically 40V or 60V, depending on the maximum input voltage
• Gate charge parameters at VGS = 5V
• Output charge, QOSS, at the relevant input voltage
• Body diode reverse recovery charge, QRR
• Gate threshold voltage, VGS(th), derived from the Miller plateau evident in the QG versus VGS plot in the
MOSFET data sheet. With a Miller plateau voltage typically in the range of 2V to 3V, the 5V gate drive
amplitude of the LM25139 provides an adequately enhanced MOSFET when on and a margin against Cdv/dt
shoot-through when off.
The MOSFET-related power losses for one channel are summarized by the equations presented in Table 7-1,
where suffixes one and two represent high-side and low-side MOSFET parameters, respectively. While the
influence of inductor ripple current is considered, second-order loss modes, such as those related to parasitic
inductances and SW node ringing, are not included.
Table 7-1. MOSFET Power Losses
POWER LOSS MODE
HIGH-SIDE MOSFET
LOW-SIDE MOSFET
MOSFET conduction(2)
(3)
Pcond1=D× IOUT2+∆IL212 ×RDSon1
Pcond2=D′× IOUT2+∆IL212 ×RDSon2
MOSFET switching
Psw1=VIN×FSW2× IOUT−∆IL2 ×tR+
IOUT+∆IL2 ×tF
Negligible
MOSFET gate drive(1)
PGate1=VCC×FSW×QG1
PGate2=VCC×FSW×QG2
MOSFET output
charge(4)
PCoss=FSW× VIN×Qoss2+Eoss1−Eoss2
Body diode
conduction
N/A
PcondBD=VF×FSW× IOUT+∆IL2 ×tdt1+
IOUT−∆IL2 ×tdt2
Body diode
reverse recovery(5)
PRR=VIN×FSW×QRR2
(1)
Gate drive loss is apportioned based on the internal gate resistance of the MOSFET, externally added series gate resistance and the
relevant driver resistance of the LM25139.
(2)
MOSFET RDS(on) has a positive temperature coefficient of approximately 4500ppm/°C. The MOSFET junction temperature, TJ, and the
rise over ambient temperature is dependent upon the device total power dissipation and the thermal impedance. When operating at or
near minimum input voltage, make sure that the MOSFET RDS(on) is rated for the available gate drive voltage.
(3)
D' = 1D is the duty cycle complement.
(4)
MOSFET output capacitances, Coss1 and Coss2, are highly non-linear with voltage. These capacitances are charged losslessly by
the inductor current at high-side MOSFET turn-off. During turn-on, however, a current flows from the input to charge the output
capacitance of the low-side MOSFET. Eoss1, the energy of Coss1, is dissipated at turn-on, but this is offset by the stored energy Eoss2 on
Coss2.
(5)
MOSFET body diode reverse recovery charge, QRR, depends on many parameters, particularly forward current, current transition
speed and temperature.
The high-side (control) MOSFET carries the inductor current during the PWM on time (or D interval) and typically
incurs most of the switching losses. Choosing a high-side MOSFET that balances conduction and switching
loss contributions is therefor imperative. The total power dissipation in the high-side MOSFET is the sum of the
losses due to conduction, switching (voltage-current overlap), output charge, and typically two-thirds of the net
loss attributed to body diode reverse recovery.
The low-side (synchronous) MOSFET carries the inductor current when the high-side MOSFET is off (or during
the 1D interval). The low-side MOSFET switching loss is negligible as the low-side MOSFET switching loss is
switched at zero voltage – current just communicates from the channel to the body diode or vice versa during
the transition dead times. The LM25139, with the adaptive gate drive timing, minimizes body diode conduction
losses when both MOSFETs are off. Such losses scale directly with switching frequency.
www.ti.com
LM25139
SLVSJ80 – OCTOBER 2025
Copyright © 2025 Texas Instruments Incorporated
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