TUSB1146 datasheet(5/68 Pages) TI2

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TUSB1146

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SLLSFB2 – APRIL 2020

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress ratings

only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Recommended

OperatingConditions. Exposure to absolute-maximum-rated conditions for extended periods mayaffect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage Range

VCC

–0.3

Voltage Range at any input or output pin

Differential voltage between positive and negative

inputs

-2.5

2.5

Voltage at differential inputs

–0.5

CMOS Inputs

–0.5

Maximum junction temperature, TJ

TUSB1146

105

°C

TUSB1146I

125

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Main power supply

3.0

3.3

3.6

Main supply ramp requirement

0.1

V(I2C)

Supply that external resistors are pulled up to on SDA and SCL

1.7

3.6

V(PSN)

Supply Noise on VCC pins (less than 4MHz)

100

TUSB1146 Operating free-air temperature

°C

TUSB1146I Operating free-air temperature

-40

°C

(1)

For more information about traditional and new thermalmetrics, see the Semiconductor and ICPackage Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TUSB1146

UNIT

RNQ (WQFN)

40 PINS

RθJA

Junction-to-ambient thermal resistance

37.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

20.7

°C/W

RθJB

Junction-to-board thermal resistance

9.5

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

9.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

2.3

°C/W

6.5 Power Supply Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

PCC(ACTIVE-USB)

Average active power

USB Only

Link in U0 with GEN2 data transmission;

EQ control pins = NC; PRBS7 pattern at

10 Gbps, VID = 1000 mVPP ; LINR_L3;

CTL1 = L; CTL0 = H

270

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