OMAP3530 datasheet(7/230 Pages) TI

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Contents

OMAP3530/25 Applications Processor

SPRS507 – FEBRUARY 2008

OMAP3530/25 Applications Processor

.............. 1

VIDEO DAC SPECIFICATIONS

..................... 124

1.1

Features

.............................................. 1

5.1

Interface Description

............................... 124

5.2

Electrical Specifications Over Recommended

1.2

Description

............................................ 4

Operating Conditions

.............................. 126

1.3

Functional Block Diagram

............................ 6

5.3

Analog Supply (vdda_dac) Noise Requirements

.. 128

TERMINAL DESCRIPTION

.............................. 8

5.4

External Component Value Choice

................ 129

2.1

Terminal Assignment

................................. 8

TIMING REQUIREMENTS AND SWITCHING

2.2

Ball Characteristics

.................................. 11

CHARACTERISTICS

.................................. 130

2.3

Multiplexing Characteristics

......................... 58

6.1

Timing Test Conditions

............................ 130

2.4

Signal Description

................................... 73

6.2

Interface Clock Specifications

..................... 130

ELECTRICAL CHARACTERISTICS

.................. 97

6.3

Timing Parameters

................................. 131

3.1

Power Domains

..................................... 97

6.4

External Memory Interfaces

........................ 132

3.2

Absolute Maximum Ratings

......................... 99

6.5

Video Interfaces

.................................... 154

3.3

Recommended Operating Conditions

............. 101

6.6

Serial Communications Interfaces

................. 171

3.4

DC Electrical Characteristics

....................... 102

6.7

Removable Media Interfaces

...................... 203

3.5

Core Voltage Decoupling

.......................... 104

6.8

Test Interfaces

..................................... 218

3.6

Power-up and Power-down

........................ 106

PACKAGE CHARACTERISTICS

.................... 224

CLOCK SPECIFICATIONS

........................... 109

7.1

Package Thermal Resistance

...................... 224

4.1

Input Clock Specifications

......................... 110

7.2

Device Support

..................................... 224

4.2

Output Clock Specifications

........................ 115

4.3

DPLL and DLL Specifications

...................... 117

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