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OMAP3530 Datasheet(PDF) 3 Page - Texas Instruments |
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OMAP3530 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 230 page ![]() www.ti.com OMAP3530/25 Applications Processor SPRS507 – FEBRUARY 2008 Ball Pitch • Package-On-Package (POP) Implementation for Memory Stacking (CBB Package Only) • 3.3-V and 1.8-V I/O, 0.8-V to 1.8-V Adaptive Core Voltage • Packages: – 515-pin PBGA Package (CBB Suffix), .5mm • Applications: Ball Pitch (Top), .4mm Ball Pitch (Bottom) – TBD – 423-pin PBGA Package (CUS Suffix), .65mm Submit Documentation Feedback OMAP3530/25 Applications Processor 3 |
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