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ECP2 Datasheet(PDF) 241 Page - Lattice Semiconductor

Part # ECP2
Description  LatticeECP2/M Family Data Sheet
PDF  386 Pages
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Manufacturer  LATTICE [Lattice Semiconductor]
Direct Link  http://www.latticesemi.com
Logo LATTICE - Lattice Semiconductor

ECP2 Datasheet(HTML) 241 Page - Lattice Semiconductor

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Pinout Information
Lattice Semiconductor
LatticeECP2/M Family Data Sheet
H8
GND
-
GND
-
H9
GND
-
GND
-
J3
GND
-
GND
-
J8
GND
-
GND
-
J9
GND
-
GND
-
M15
GND
-
GND
-
M2
GND
-
GND
-
P9
GND
-
GND
-
R12
GND
-
GND
-
R5
GND
-
GND
-
T1
GND
-
GND
-
T16
GND
-
GND
-
D10
NC
-
NC
-
D11
NC
-
NC
-
D12
NC
-
NC
-
D13
NC
-
NC
-
D14
NC
-
NC
-
D4
NC
-
NC
-
D5
NC
-
NC
-
D6
NC
-
NC
-
D7
NC
-
NC
-
E11
NC
-
NC
-
E6
NC
-
NC
-
E8
NC
-
NC
-
E9
NC
-
NC
-
F10
NC
-
NC
-
F7
NC
-
NC
-
F8
NC
-
NC
-
F9
NC
-
NC
-
* Supports true LVDS. Other differential signals must be emulated with external resistors.
** These dedicated input pins can be used for GPLLs or GDLLs within the respective quadrant.
***Due to packaging bond out option, this DQS does not have all the necessary DQ pins bonded out for a full 8-bit data width.
Note: VCCIO and GND pads are used to determine the average DC current drawn by I/Os between GND/VCCIO connections, or between the
last GND/VCCIO in an I/O bank and the end of an I/O bank. The substrate pads listed in the Pin Table do not necessarily have a one to one
connection with a package ball or pin.
LFE2M-20E/SE and LFE2M-35E/SE Logic Signal Connections: 256 fpBGA
LFE2M20E/SE
LFE2M35E/SE
Ball
Number
Ball/Pad
Function
Bank
Dual Function
Differential
Ball/Pad
Function
Bank
Dual
Function
Differential



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