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ECP2 Datasheet(PDF) 267 Page - Lattice Semiconductor

Part # ECP2
Description  LatticeECP2/M Family Data Sheet
PDF  386 Pages
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Manufacturer  LATTICE [Lattice Semiconductor]
Direct Link  http://www.latticesemi.com
Logo LATTICE - Lattice Semiconductor

ECP2 Datasheet(HTML) 267 Page - Lattice Semiconductor

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Pinout Information
Lattice Semiconductor
LatticeECP2/M Family Data Sheet
W19
NC
-
W18
NC
-
V17
NC
-
V18
NC
-
D15
NC
-
G14
NC
-
G15
NC
-
D14
NC
-
E15
NC
-
E14
NC
-
F15
NC
-
F14
NC
-
F13
NC
-
G12
NC
-
G13
NC
-
H8
VCCPLL
-
H15
VCCPLL
-
R8
VCCPLL
-
R15
VCCPLL
-
* Supports true LVDS. Other differential signals must be emulated with external resistors.
** These dedicated input pins can be used for GPLLs or GDLLs within the respective quadrant.
***For density migration, board design must take into account that these sysCONFIG pins are dual function for the lower density devices
(ECP2M20 and ECP2M35) and are dedicated pins for the higher density devices (ECP2M50, ECP2M70 and ECP2M100).
****Due to packaging bond out option, this DQS does not have all the necessary DQ pins bonded out for a full 8-bit data width.
Note: VCCIO and GND pads are used to determine the average DC current drawn by I/Os between GND/VCCIO connections, or between the
last GND/VCCIO in an I/O bank and the end of an I/O bank. The substrate pads listed in the Pin Table do not necessarily have a one to one
connection with a package ball or pin.
LFE2M50E/SE Logic Signal Connections: 484 fpBGA (Cont.)
LFE2M50E/SE
Ball Number
Ball/Pad Function
Bank
Dual Function
Differential



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