ABSOLUTE MAXIMUM RATINGS

(1)

THERMAL CHARACTERISTICS

(1)

ADS5481

ADS5482

ADS5483

Over operating free-air temperature range, unless otherwise noted.

ADS5481, ADS5482, ADS5483

UNIT

AVDD5 to GND

6

V

Supply voltage

AVDD3 to GND

5

V

DVDD3 to GND

5

V

Valid when AVDD5 is within normal operating range. When AVDD5 is

off, analog inputs should be <0.5V. If not, the protection diode between

Analog input to

the inputs and AVDD5 will become forward-biased and could be

–0.3 to (AVDD5 + 0.3)

V

GND

damaged or shorten device lifetime (see Figure 60). Short transient

conditions during power on/off are not a concern.

Valid when AVDD3 is within normal operating range. When AVDD3 is

off, clock inputs should be <0.5V. If not, the protection diode between the

Clock input to GND inputs and AVDD3 will become forward-biased and could be damaged or

–0.3 to (AVDD3 + 0.3)

V

shorten device lifetime (see Figure 67). Short transient conditions during

power on/off are not a concern.

CLKP to CLKM

±2.5

V

Digital data output to GND

–0.3 to (DVDD3 + 0.3)

V

Digital data output plus-to-minus

±1

V

Operating temperature range

–40 to +85

°C

Maximum junction temperature

+150

°C

Storage temperature range

–65 to +150

°C

ESD, human-body model (HBM)

2

kV

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Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime are available upon

request.

PARAMETER

TEST CONDITIONS

TYP

UNIT

Soldered thermal pad, no airflow

20

Soldered thermal pad, 150-LFM airflow

16

°C/W

thermal resistance from the junction to the package case (top)

7

thermal resistance from the junction to the thermal pad (bottom)

0.2

(1)

Using 49 thermal vias ( 7 × 7 array). See PowerPAD Package in the Application Information section.

Copyright © 2008, Texas Instruments Incorporated

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