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MIC2155 Datasheet(PDF) 25 Page - Micrel Semiconductor |
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MIC2155 Datasheet(HTML) 25 Page - Micrel Semiconductor |
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25 / 33 page ![]() Micrel, Inc. MIC2155/2156 May 2009 25 M9999-052709-A (408) 944-0800 For the high-side switch, the maximum DC power dissipation is: ()2 ) rms ( 1 SW 1 DSON ) DC ( 1 SWITCH I R P × = For the low-side switch, the DC power dissipation is: ()2 ) rms ( 2 SW 2 DSON ) DC ( 2 SWITCH I R P × = The switching loss for each of the high-side MOSFETs is: S t ) peak ( SW IN AC f T I V P × × × = The total power dissipation for each MOSFET is: AC ) DC ( 1 SWITCH total _ FET P P P + = External Schottky Diode A freewheeling diode in parallel with the low-side FET is needed to keep the inductor current flow continuous while both MOSFETs are turned off (dead time). Dead time is necessary to prevent current from flowing unimpeded through both MOSFETs. An external Schottky diode is not necessary for circuit operation since the low-side MOSFET contains a parasitic body diode. An external diode will improve efficiency due to its lower forward voltage drop as compared to the internal parasitic diode in the FET. It may also decrease high frequency noise because the schottky diode junction does not suffer from reverse recovery. If the MOSFET body diode is used, it must be rated to handle the peak and average current. The body diode may have a relatively slow reverse recovery time and a relatively high forward voltage drop. The power lost in the diode is proportional to the forward voltage drop of the diode. As the high-side MOSFET starts to turn on, the body diode becomes a short circuit for the reverse recovery period, dissipating additional power. The diode recovery and the circuit inductance will cause ringing during the high-side MOSFET turn on. If the internal FET diode is used, power dissipated during the dead time should be added to the PDISS of the low-side MOSFET. An external Schottky diode conducts at a lower forward voltage preventing the body diode in the MOSFET from turning on. The lower forward voltage drop dissipates less power than the body diode. The lack of a reverse recovery mechanism in a Schottky diode causes is less ringing and power loss. Depending on the circuit components and operating conditions, an external Schottky diode may give a ½% to 1% improvement in efficiency. This power dissipation is calculated below S d OUT ) ave ( D f t 2 I I × × × = Where td is the dead time when both MOSFETs are off. The reverse voltage requirement of the diode is: IN RRM _ DIODE V V = The power dissipated by the diode is: F AVE _ D DIODE V I P × = where VF is the forward voltage at the peak diode current. Snubber Design A snubber is used to damp out high frequency ringing caused by parasitic inductance and capacitance in the buck converter circuit. A snubber is needed for each of the two phases in the converter. Figure 22 shows a simplified schematic of one of the buck converter phases. Stray capacitance consists mostly of the two MOSFET’s output capacitance (COSS). The stray inductance is mostly package and etch inductance. The arrows show the resonant current path when the high side MOSFET turns on. This ringing causes stress on the semiconductors in the circuit as well as increased EMI. Q1 Q2 COUT CIN LSTRAY1 LSTRAY2 L LSTRAY3 LSTRAY4 Sync_buck Controller VDC COSS1 COSS2 + – Figure 22. Output Parasitics One method of reducing the ringing is to use a resistor and capacitor to lower the Q of the resonant circuit. The circuit in Figure 23 shows the resistor in between the switch node and ground. Capacitor Cs is used to block DC and minimize the power dissipation in the resistor. This capacitor value should be between 5 and 10 times the parasitic capacitance of the MOSFET COSS. A capacitor that is too small will have high impedance and prevent the resistor from damping the ringing. A capacitor that is too large causes unnecessary power dissipation in the resistor, which lowers efficiency. The snubber components should be placed as close as possible to the low-side MOSFET and/or external schottky diode since in contributes to most of the stray capacitance. Placing the snubber too far from the FET or using etch that is too long or thin will add inductance to |
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