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MIC2155 Datasheet(PDF) 32 Page - Micrel Semiconductor

Part # MIC2155
Description  2-Phase, Single Output, PWM Synchronous Buck Control IC
PDF  33 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC2155 Datasheet(HTML) 32 Page - Micrel Semiconductor

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Micrel, Inc.
MIC2155/2156
May 2009
32
M9999-052709-A
(408) 944-0800
ground planes.
Ceramic
capacitors
are
recommended
for
most
decoupling and filtering applications because of their low
impedance
and
small
size.
Depending
on
the
application, most dielectrics (X5R, X7R, NPO) are
acceptable, however, Z5U type Ceramic capacitor
dielectrics are not recommended due to their large
change in capacitance over temperature and voltage.
Design and Layout Checklist
• Ceramic capacitor placed between the HS FET drain
and the LSFET source.
• MOSFET gate drive traces must be low inductance
and routed away from noise sensitive analog signals,
components and ground planes.
• The signal and power ground planes must be
separated to prevent high current and fast switching
signals from interfering with the low level, noise
sensitive analog signals. These planes should be
connected at only 1 point, next to the MIC2155/6
controller.
• The following signals and their components should be
decoupled or referenced to the power ground plane:
VIN1, VIN2, VDD, PGND1, PGND2
• These analog signals should be referenced or
decoupled to the analog ground plane:
AVDD, SYNC, EN, SS, PGOOD, COMP1, COMP2,
FB2, EA2, VOUT, FB1, AGND
• Place the current sharing RC components (that
connect across the inductor) and any related filtering
components close to the FB2, EA2+ and VOUT pins
(18, 17, 20). The traces connecting the inductors and
these components should be routed close together to
minimize pickup or EMI radiation.
• Place the overcurrent sense resistor close to the CS1
pin (pin 4). The trace coming from the switch node to
this resistor has high dv/dt and should be routed away
from other noise sensitive components and traces.
• The remote sense traces must be routed close
together or on adjacent layers to minimize noise
pickup. The traces should be routed away from the
switch node, inductors, MOSFETs and other high
dv/dt or di/dt sources.



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