SE97BTP datasheet(38/53 Pages) NXP

38 / 53 page

SE97B_1

Product data sheet

Rev. 01 — 27 January 2010

38 of 53

NXP Semiconductors

SE97B

DDR memory module temp sensor with integrated SPD

10. Limiting values

11. Characteristics

Table 29.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

VDD

supply voltage

−0.5

+4.3

voltage on any other pin

SDA, SCL, A1, A2,

EVENT pins

−0.5

+4.3

VA0

voltage on pin A0

overvoltage input; A0 pin

−0.5

+12.5

Isink

sink current

SDA, EVENT pins

−1+10

Tj(max)

maximum junction temperature

150

°C

Tstg

storage temperature

−65

+165

°C

Table 30.

Thermal sensor characteristics

VDD = 3.0 V to 3.6 V; Tamb = −40 °C to +125 °C; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Tlim(acc)

temperature limit

accuracy

B-grade; VDD = 3.0 V to 3.6 V

Tamb =75 °Cto95 °C

−1.0

±0.5

+1.0

°C

Tamb =40 °Cto125 °C

−2.0

±1.0

+2.0

°C

Tamb = −40 °Cto+125 °C

−3.0

±2+3.0

°C

Tres

temperature resolution

0.125

°C

Tconv

conversion period

100

120

Ef(conv)

conversion rate error

percentage error in programmed data

−30

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