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AMPL138ZCE3 Datasheet(PDF) 124 Page - Texas Instruments

Part # AMPL138ZCE3
Description  OMAP-L138 Low-Power Applications Processor
PDF  268 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

AMPL138ZCE3 Datasheet(HTML) 124 Page - Texas Instruments

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A1
A1
E0
T
E1
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OMAP-L138 Low-Power Applications Processor
SPRS586A – JUNE 2009 – REVISED AUGUST 2009
www.ti.com
Figure 6-24 shows the topology and routing for the DQS and DQ net class; the routes are point to point.
Skew matching across bytes is not needed nor recommended.
Figure 6-24. DQS and DQ Routing and Topology
Table 6-36. DQS and DQ Routing Specification
No.
Parameter
Min
Typ
Max
Unit
Notes
1
DQS E Skew Length Mismatch
25
Mils
2
Center to center DQS to other DDR2/mDDR trace
4w
See Note (1)
spacing
3
DQS/D nominal trace length
DQLM-50
DQLM
DQLM+50
Mils
See Notes (2), (3)
4
D to DQS Skew Length Mismatch
100
Mils
See Note (3)
5
D to D Skew Length Mismatch
100
Mils
See Note (3)
6
Center to center D to other DDR2/mDDR trace
4w
See Notes (1), (4)
spacing
7
Center to Center D to other D trace spacing
3w
See Notes (5), (1)
8
DQ/DQS E Skew Length Mismatch
100
Mils
See Note (3)
(1)
Center to center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing
congestion.
(2)
Series terminator, if used, should be located closest to DDR.
(3)
There is no need and it is not recommended to skew match across data bytes, i.e., from DQS0 and data byte 0 to DQS1 and data byte
1.
(4)
D's from other DQS domains are considered other DDR2/mDDR trace.
(5)
DQLM is the longest Manhattan distance of each of the DQS and D net class.
Peripheral Information and Electrical Specifications
124
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