E6000 datasheet(4/122 Pages) INTEL

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Datasheet

5.2.5

THERMTRIP# Signal ................................................................................89

5.3

Thermal Diode...................................................................................................90

5.4

Platform Environment Control Interface (PECI) ......................................................92

5.4.1

Introduction...........................................................................................92

5.4.1.1

Key Difference with Legacy Diode-Based Thermal Management .......92

5.4.2

PECI Specifications .................................................................................94

5.4.2.1

PECI Device Address..................................................................94

5.4.2.2

PECI Command Support .............................................................94

5.4.2.3

PECI Fault Handling Requirements ...............................................94

5.4.2.4

PECI GetTemp0() Error Code Support ..........................................94

6Features ..................................................................................................................95

6.1

Power-On Configuration Options ..........................................................................95

6.2

Clock Control and Low Power States.....................................................................95

6.2.1

Normal State .........................................................................................96

6.2.2

HALT and Extended HALT Powerdown States ..............................................96

6.2.2.1

HALT Powerdown State ..............................................................96

6.2.2.2

Extended HALT Powerdown State ................................................97

6.2.3

Stop Grant and Extended Stop Grant States ...............................................97

6.2.3.1

Stop Grant State .......................................................................97

6.2.3.2

Extended Stop Grant State .........................................................98

6.2.4

Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop

State, and Stop Grant Snoop State ...........................................................98

6.2.4.1

HALT Snoop State, Stop Grant Snoop State ..................................98

6.2.4.2

Extended HALT Snoop State, Extended Stop Grant Snoop State.......98

6.3

Enhanced Intel® SpeedStep® Technology .............................................................98

Boxed Processor Specifications.............................................................................. 101

7.1

Mechanical Specifications.................................................................................. 102

7.1.1

Boxed Processor Cooling Solution Dimensions........................................... 102

7.1.2

Boxed Processor Fan Heatsink Weight ..................................................... 103

7.1.3

Boxed Processor Retention Mechanism and Heatsink Attach Clip

Assembly............................................................................................. 103

7.2

Electrical Requirements .................................................................................... 103

7.2.1

Fan Heatsink Power Supply .................................................................... 103

7.3

Thermal Specifications...................................................................................... 105

7.3.1

Boxed Processor Cooling Requirements.................................................... 105

7.3.2

Fan Speed Control Operation (Intel® Core2 Extreme Processor

X6800 Only) ........................................................................................ 107

7.3.3

Fan Speed Control Operation (Intel® Core2 Duo Desktop Processor

E6000 and E4000 Sequences Only) ......................................................... 107

Balanced Technology Extended (BTX) Boxed Processor Specifications ................... 111

8.1

Mechanical Specifications.................................................................................. 112

8.1.1

Balanced Technology Extended (BTX) Type I and Type II Boxed Processor

Cooling Solution Dimensions .................................................................. 112

8.1.2

Boxed Processor Thermal Module Assembly Weight ................................... 114

8.1.3

Boxed Processor Support and Retention Module (SRM) .............................. 115

8.2

Electrical Requirements .................................................................................... 116

8.2.1

Thermal Module Assembly Power Supply.................................................. 116

8.3

Thermal Specifications...................................................................................... 118

8.3.1

Boxed Processor Cooling Requirements.................................................... 118

8.3.2

Variable Speed Fan ............................................................................... 118

Debug Tools Specifications .................................................................................... 121

9.1

Logic Analyzer Interface (LAI) ........................................................................... 121

9.1.1

Mechanical Considerations ..................................................................... 121

9.1.2

Electrical Considerations ........................................................................ 121

E6000 Datasheet(PDF) 4 Page - Intel Corporation

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