MPC5606S datasheet(62/136 Pages) FREESCALE

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MPC5606S Microcontroller Data Sheet, Rev. 6

Freescale Semiconductor

•

Do not:

— Violate injection current limit per IO/All IO pins as per specifications

— Connect sensitive supplies/ground on noisy supplies/ground (that is, ADC, PLL, and OSC)

— Use SMD supply for generation of noise free supply as these are most noisy lines in the system

— Connect different VDD pins (connected together inside the device) to different potentials.

3.5

Thermal characteristics

3.5.1

General notes for specifications at maximum junction temperature

An estimate of the chip junction temperature, TJ, can be obtained from Equation 1:

TJ = TA + (RJA  PD)

Eqn. 1

where:

= ambient temperature for the package (°C)

RJA = junction to ambient thermal resistance (°C/W)

= power dissipation in the package (W)

Table 17. LQFP thermal characteristics

Symbol

Parameter

Conditions

Value

Unit

144-pin 176-pin

RJA

CC D Thermal resistance, junction-to-ambient

natural convection1

1 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board—1s

°C/W

Four layer board—2s2p

°C/W

RJMA CC D Thermal resistance, junction-to-moving-air

ambient2

@ 200 ft./min., single layer

board—1s

°C/W

@ 200 ft./min., four layer

board—2s2p

°C/W

RJB

CC D Thermal resistance, junction-to-board2

2 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

—29

°C/W

RJCtop CC D Thermal resistance, junction-to-case

(top)3

3 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

—10

°C/W



CC D Junction-to-package top thermal

characterization parameter, natural

convection4

4 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

—2

°C/W

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