TPS62361BYZHT datasheet(3/52 Pages) TI

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TPS62360, TPS62361B, TPS62362

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SLVSAU9A

– MAY 2011 – REVISED AUGUST 2011

THERMAL INFORMATION

TPS6236x

THERMAL METRIC(1)

YZH

UNITS

16 PINS

θJA

Junction-to-ambient thermal resistance(2)

94.8

θJCtop

Junction-to-case (top) thermal resistance(3)

θJB

Junction-to-board thermal resistance(4)

°C/W

ψJT

Junction-to-top characterization parameter(5)

3.2

ψJB

Junction-to-board characterization parameter(6)

θJCbot

Junction-to-case (bottom) thermal resistance(7)

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific

JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

ψJT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA, using a procedure described in JESD51-2a (sections 6 and 7).

(6)

The junction-to-board characterization parameter,

ψJB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining

θJA , using a procedure described in JESD51-2a (sections 6 and 7).

(7)

The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

RECOMMENDED OPERATING CONDITIONS

MIN

TYP

MAX

UNIT

VIN

Input voltage range, VIN

IOUT ≤ 2.5A

2.5

5.5

IOUT > 2.5A

5.5

IOUT

Max. continuous output current(1)

2.5

Operating ambient temperature

–40

°C

Operating junction temperature

–40

125

°C

(1)

Drawing continuously more than 2.5A might impact the device life time. SeeTHERMAL AND DEVICE LIFE TIME INFORMATION for

details.

ELECTRICAL CHARACTERISTICS

Unless otherwise noted the specification applies for VIN = 3.6V over an operating ambient temp.

–40°C ≤ TA ≤ 85°C; Circuit

of Parameter Measurement Information section (unless otherwise noted). Typical values are for TA = 25°C.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

INPUT

VIN

Input voltage range at VIN, AVIN

2.5

5.5

VDD

I2C and registers supply voltage range

1.15

3.6

ISD(AVIN)

Shutdown current into AVIN

EN = LOW, VDD = 0V

0.65

µA

TA = 25°C

0.5

µA

EN = LOW,

ISD(VIN)

Shutdown current into VIN

VDD = 0V

TA = 85°C

µA

ISD(VDD)

Shutdown current into VDD

EN = LOW, I2C bus idle

0.01

µA

PFM mode

µA

EN = HIGH,

Operating quiescent current into (AVIN +

Forced PWM

IOUT = 0mA,

VIN)

mode

180

µA

not switching

(Test Mode)

Input voltage falling, EN = High

2.3

2.45

VUVLO

Under voltage lock out at AVIN

Input voltage rising, EN = Low

1.3

VUVLO,HYST(AVI

Under voltage lock out hysteresis at AVIN

Input voltage rising

110

VDD,UVLO

Under voltage lock out at VDD

Input voltage falling

0.7

0.92

1.1

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